Box Genie has launched its mobile 3D Design Studio, enabling businesses to create branded, professional packaging on the go with instant 360-degree previews. Kansas City, Missouri--(Newsfile Corp. - ...

Innolux signed an agreement with Japan-based Tech Extension Co. (TEX) and Tech Extension Taiwan Co. (TEX-T) to introduce next-generation 3D packaging technologies based on Bumpless Build Cube (BBCube) ...

SINGAPORE, July 9, 2025 /PRNewswire/ -- As digital transformation sweeps across the global packaging sector, Pacdora has emerged as a key force driving change. As a leading online 3D packaging design ...

Advanced packaging technology continues to make waves this year after being a prominent highlight in 2023 and is closely tied to the fortunes of a new semiconductor industry star: chiplets. IDTechEx’s ...

Various techniques for embedding 3D packaging to boost power density. Different methods for cooling chips using 3D packaging. New and emerging technologies for 3D packaging are being deployed at the ...

With more mmWave-capable and HPC chip designs being developed, AiP, 3D stacking and other advanced packaging technologies will be increasingly needed for commercial applications, according to industry ...

Inter-Die Gapfill Tool Expands Industry-Leading Portfolio of Solutions for 3D Integration and Chiplet Technologies; Paves Way for New, AI-Accelerating Architectures "VECTOR TEOS 3D deposits the ...

The power electronics industry and the semiconductor industry, inseparably intertwined with one another, are facing unprecedented efficiency, cost, construction and thermal challenges which provide ...

As microelectromechanical-systems (MEMS) ICs satisfy more functions and proliferate, packaging them into high-density form factors like 3D becomes more of a challenge than conventional ICs. To ...

If you are familiar with Moore’s Law, you’ve probably read pronouncements that the premise of transistor counts doubling each year is reaching a wall due to complex process technologies and device ...