IBM and 3M on Wednesday said they will develop new adhesives designed to build silicon towers that will be packaged on 3D semiconductors. The collaboration---IBM brings the semiconductor know-how and ...
Yesterday it was the "roof tile" method of stacking memory chips, and today IBM and 3M have announced that they are teaming up to develop a silicon glue that can be used to form "towers" out of ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results