New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...
It's not just AMD, but Intel, Samsung, LG Innotek, and SK Group's US subsidiary Absolics are all systems pushing into glass substrate technology for advanced packaging. Intel announced in September ...
TOKYO--(BUSINESS WIRE)--Shin-Etsu Chemical Co., Ltd. (TOKYO: 4063) (Head Office: Tokyo; President: Yasuhiko Saitoh; hereinafter, “Shin-Etsu Chemical”) has developed equipment to manufacture ...
Semiconductor components have gained universal prominence, playing an essential role in everyday life. They influence global communication, shape interactions, offer amusement, and enable various ...
In this work, we propose a new signal routing method for solving routing problems that occur in the design process of semiconductor package substrates. Our work uses a topological transformation of ...
Semiconductor glass substrates are drawing attention as a key material that can solve problems in the packaging domain, which has hit technical limits in the age of artificial intelligence (AI). Major ...
Why it matters: Many believe that glass substrate technology will enable the industry to sustain Moore's Law beyond 2030, ensuring continuous development without being constrained by process size ...
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