Today’s heterogeneously integrated semiconductor packages represent a breakthrough technology that enables dramatic increases in bandwidth and performance with reduced power and cost compared to what ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

As high-speed data access, transmission, and storage move from high-end computing and long-haul SONET (synchronous-optical-network) applications into portable computing and Ethernet LANs (local-area ...

Historically IC package design has been a relatively simple task which allowed the die bumps to be fanned out on a package substrate to a floorplan geometry suitable for connecting to a printed ...

Packing more IC functionality into smaller form factors stacks the deck against IC makers and foreshadows difficult interconnect challenges. How much can one package take? As consumer electronics ...

ROME, April 20, 2023 /PRNewswire/ -- Anna Fontanelli, Monozukuri S.p.A. CEO and Founder, demonstrated MZ-GENIO™, the first integrated IC/Packaging EDA tool, during the "Advanced 3D architecture and ...

Components of all types, including sensors, interconnects, displays, and indicators, are placing demands on packaging design for consumer end products. Whether it’s a connector, cable, display, ...