ADLINK Technology has launched what it says is the first COM Express module to use Intel Core Ultra Series 3 processors.

In early January 2026, Visteon showcased its most comprehensive CES exhibit to date in Las Vegas, unveiling production-ready cockpit electronics, AI computing solutions, advanced displays, and ...

For CES 2026, HP is debuting the EliteBoard G1a, a keyboard with a modular business Copilot+ PC inside. And this isn't just ...

The module integrates a high-efficiency AI SoC with in-house software and peripherals to serve as a powerful Edge AI platform ...

Lanner Electronics, a global leader in rugged Edge AI hardware, today announced the launch of the EAI-I351, a robotic AI platform engineered for the next era of physical AI. Built on NVIDIA Jetson ...

Thermal module maker Taiwan Microloops Corp. reported consolidated revenue of NT$317 million (US$10.2 million) in December ...

AAEON BOXER-8742AI is a fanless Edge AI embedded system powered by an NVIDIA Jetson T4000 that was unveiled along with the ...

The company showcases 16-layer HBM4 product with 48GB, next generation HBM product, for the first time during the exhibition. The product is the next generation product of 12-layer HBM4 product with ...

Visteon will present two AI computing platforms addressing different automaker needs.

At CES 2026, GIGABYTE is unlocking the full potential of AMD Ryzen™ 9000 Series Processors with AMD 3D V-Cache technology.

From mobile manipulators to humanoids, Boston Dynamics, Caterpillar, Franka Robots, Humanoid, LG Electronics and NEURA ...