In early January 2026, Visteon showcased its most comprehensive CES exhibit to date in Las Vegas, unveiling production-ready cockpit electronics, AI computing solutions, advanced displays, and ...

Based on Qualcomm’s Dragonwing IQ-X platform, Advantech’s three edge AI compute boards deliver up to 45 TOPS of AI ...

For CES 2026, HP is debuting the EliteBoard G1a, a keyboard with a modular business Copilot+ PC inside. And this isn't just ...

The module integrates a high-efficiency AI SoC with in-house software and peripherals to serve as a powerful Edge AI platform ...

AAEON BOXER-8742AI is a fanless Edge AI embedded system powered by an NVIDIA Jetson T4000 that was unveiled along with the ...

Thermal module maker Taiwan Microloops Corp. reported consolidated revenue of NT$317 million (US$10.2 million) in December ...

The company showcases 16-layer HBM4 product with 48GB, next generation HBM product, for the first time during the exhibition. The product is the next generation product of 12-layer HBM4 product with ...

At least that’s the idea behind the Bit-Brick Cluster K1. Real-world performance will obviously vary depending on the task. But for applications that support parallel processing, this cluster board ...

Voyant is leading the development of a new generation of FMCW LiDAR to address broad applications in the physical AI ...

Visteon will present two AI computing platforms addressing different automaker needs.

At CES 2026, GIGABYTE is unlocking the full potential of AMD Ryzen™ 9000 Series Processors with AMD 3D V-Cache technology.